Job
In this position, you will take technical responsibility for Die-Bonding and microassembly projects, develop processes, optimize procedures, and train customers on FINEPLACER systems and comparable equipment.
Job summary
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Your role in the team
- Have you independently developed and implemented demanding die bonding and precision assembly processes on FINEPLACER systems or comparable equipment? At Finetech, you will take technical responsibility for customer applications—from feasibility assessment and process stabilization to documented handover and customer training.
- We are looking for an experienced professional who can immediately apply their in-depth knowledge of machinery and processes. After a brief, focused onboarding covering our specific systems, products, and workflows, you will independently take on suitable customer projects. A solid command of the fundamentals of die bonding and precision assembly is essential.
- You clarify customer requirements, assess technical feasibility, and define measurable success criteria, test plans, effort, and required resources. You raise technical risks and missing information at an early stage.
- You select machine configurations, process modules, bonding tools, and component fixtures, and specify the necessary modifications in collaboration with Design and Development.
- You prepare components and equipment, set up bonding processes independently, and optimize alignment, positioning, and relevant temperature, force, and time profiles. For automated systems, you create and optimize process recipes and image processing workflows.
- You develop and validate reproducible assembly and joining processes, for example for die attach, flip-chip, photonic components, or microsystems. You systematically identify the causes of errors and derive robust process windows.
- You evaluate results using appropriate measurement and testing methods and document parameters, samples, results, and limitations clearly in application reports and our CRM.
- You support the transition from the feasibility study to the customer order, assist with process acceptance at the plant and at the customer’s site, and deliver application-specific training as well as advanced troubleshooting.
- You advise international customers in collaboration with Sales and Service, support technical proposals and services, and communicate effort, timelines, and deviations clearly and reliably.
- You make process knowledge reusable as standards and reference applications, provide subject-matter support to colleagues, and contribute to demos, trade fairs, and technical marketing content.
Our expectations of you
Education
- A degree in engineering or a natural science, such as microsystems engineering, mechanical engineering, mechatronics, materials engineering, or physics, or an equivalent qualification combined with relevant practical experience.
Qualifications
- Extensive hands-on experience with FINEPLACER systems or technologically comparable precision die bonders or flip-chip bonders. You have set up these machines yourself, developed processes, and troubleshot issues. What matters is comparable alignment, positioning, and bonding work at the micrometer or submicrometer level.
- A solid understanding of the entire process chain: component and substrate assessment, material compatibility, tooling, optical alignment, parallelism, component handling, process control, and quality assessment. You can clearly explain the interactions between the machine, tooling, material, and process.
- Demonstrable success in independently managed customer or development projects—from requirements clarification through to reproducible results and robust technical documentation.
- German language skills at least at B2 level of the Common European Framework of Reference for Languages, as well as good English skills for technical consulting, documentation, and training.
- You are based in Berlin or the surrounding area and can regularly work on our machines on site. Occasional international business trips to customers and events are possible for you.
Experience
- At least five years of relevant professional experience in the hands-on development of applications or processes for die bonding, flip-chip, or high-precision microassembly.
- Solid practical experience in at least two relevant joining technologies, such as adhesive bonding or die attach, thermocompression bonding, eutectic soldering, or thermosonic or ultrasonic bonding.
- A structured, analytical approach to work and experience with systematic test planning, measurement data analysis, and root cause analysis. You are confident working with sensitive components and are familiar with ESD and cleanliness requirements.
What we offer
- An open company culture that encourages personal responsibility and enables employees to contribute their own ideas.
- A modern work environment with ample parking, a large communal kitchen, a sun terrace, and a beach volleyball court.
- Free drinks and fresh fruit every day.
- Promotion of health and sporting activities.
- Family-friendly working hours with core hours and flexible scheduling.
- Fair compensation.
- Contribution toward occupational pension provision.
- JobRad e-bike and bicycle leasing program.
- Option to borrow company e-bikes.
Benefits
Food & drink
Health, fitness & fun
Job locations
About your employer
Finetech is the leading machine builder for precision die bonding & sophisticated SMD rework. Our systems are used in research laboratories as well as in industrial production.
- 1992
- Established Company
- Onsite
- Engineering Industry
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