Job
- Level
- Experienced
- Job Field
- Application
- Employment Type
- Full Time
- Contract Type
- Permanent employment
- Location
- Regensburg
- Working Model
- Onsite
Job Summary
In this role, you will take responsibility for bonding processes, perform demo installations on-site at customer locations, analyze process data, and develop custom die bonding solutions in close collaboration with R&D teams.
Your role in the team
- Assumption of process responsibility as well as establishment of bond processes with our clients.
- Installation of our systems directly on-site at the customer's location
- Independent execution of customer demos
- Implementation of complex Die-Bond processes
- Analysis and evaluation of process data
- Development and customization of customer-specific processes in the Die-Bonding sector.
- Close collaboration with internal and external R&D teams
- Presentation of technical results to a professional audience - internally and externally
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Our expectations of you
Education
- Successfully completed studies in engineering or a comparable technical qualification
Qualifications
- Willingness to travel internationally and enjoyment of working in direct customer contact
- Structured, independent, and meticulous work approach
- Strong team player and excellent communication skills
- Very good command of English (spoken and written)
Experience
- Ideally, initial experience in the semiconductor industry, particularly in die bonding.
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What we offer
- Flexible working time models
- Additional benefits, including JobRad and RVV Jobticket / Deutschlandticket
- Company pension scheme
- Appreciative collaboration with strong team cohesion, an open communication culture, and a family-like working atmosphere with flat hierarchies.
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Benefits
Work-Life-Integration
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Job Locations
This is your employer
ASM Assembly Systems GmbH & Co. KG
Als ASM Assembly Systems mit Sitz in München bilden wir das Geschäftssegment SMT Solutions von ASM Pacific Technology. Unsere Marke DEK steht für Best-in-Class Drucker für SMT-, Semiconductor- und Solarmärkte. Mit unserer Marke SIPLACE sind wir Technologieführer bei SMT Bestückautomaten.
Description
- Founding year
- 1948
- Company Type
- Established Company
- Working Model
- Hybrid, Onsite
- Industry
- Industry, Production, Electronics, Automatization